Conference Introduction

Sponsored by the ministry of science and technology of People’s Republic of China and Chinese Academy and Sciences, SIP has held CHInano Conference & Expo each year since 2010.This year is going to be 13th CHInano. With 12 years success, CHInano has become the most influential conference & Expo for nano technology in China. Since 9th CHInano in 2018, Wintech Nano(Suzhou) Co. Ltd. Joined by Jiangsu Nano Technology Innovation Center has sponsored Symposium for Failure Analysis & Application in CHInano. In the past 4 years, the symposium was supported by companies, associations, universities and institutes, and attracted more than 1500 professionals from semiconductor industry.

2022 5th Symposium for Semiconductor Failure Analysis & Application will focus on failure analysis of RF IC, Filter IC and Power Device. This year symposium will share FA learnings and case studies for attendees. This yearWe will invite experts, professors, researchers and engineers to Share relevant analysis and testing technology cases, and discuss the development and application trend of semiconductor analysis and detection technology.


Organization

Organized by

    Wintech-Nano (Suzhou) Co. Ltd.


supported by

    • Jiangsu Nanotech Industry Innovation & Development Center
    • China Semiconductor Industry Association MEMS Branch
    • Thermo Fisher Scientific
    • Hitachi High-Tech Scientific Solutions Co. Ltd.
    • Zeiss China
    • PHI(China) Limited
    • Espec China

Main topics

2021 Agenda Arrangement



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Data:Oct. 28

Location:B1 Exhibition Hall Room 1

Time

Speaker

Speaker ’s Position / Organization and Speech Title

8:55-9:00

Xiaomin Li

Chairman&CEO, Wintech-Nano(Suzhou) Co. Ltd
Welcome and Opening Remark

9:00-9:25

Baoyong Chi

Professor and Vice President, Institute of Micro Electronics, Tsinghua University
Development and Innovation of Integrated Circuit Technology

9:25-9:50

Hongyu Wang

Regional President, Bosch Sensortec GmbH
Smart algorithms, embedded AI and MEMS sensors – the silent enablers of sophisticated daily-life use cases

9:50-10:15

Charles Song

General Manager, Foundry Markeitng of Samsung Electronics China
Solutions for China Fabless Tomorrow

10:15-10:30

Tea Break

10:30-10:55

Zhaobing Li

Vice President, Beijing Zhicun (WITIN) Technology Co. Ltd.
Computing-in-memory SoC

11:00-12:00

Panel Discussion

12:00-13:30

Lunch Break

13:30-13:55

Lilong Lai

Senior FA Expert
Failure Analysis in IC/Devices and Characterizations with Nano-dimension

13:55-14:20

Geng Chen

Manager, Zhejiang Raysea Technology Co Ltd.
VCSEL and its applications in consumer electronics, datacom, and automotive

14:20-14:45

Younan Hua

Vice President, Wintech-Nano (Singapore) Co. Ltd.
Studies and Application of New Failure Analysis Technique for Gate Oxide Integrity (GOI) Failure in Semiconductor Manufacturing and Wafer Fabrication

14:45-15:10

Cao Xiaoxiao

Thermo Fisher Scientific
Yield Improvements& Advanced R&D - New Progress of Thermo Fisher Failure Analysis Solutions

15:10-15:30

Tea Break

15:30-15:55

Ou Zhou

General Manager, Hitachi High-Tech Scientific Solutions (Beijing) Co. Ltd.
Application capability of Hitachi EM series products in Semiconductor field

15:55-16:20

Chengliang Huang

Business Development Manager, Carl Zeiss (Shanghai) Co., Ltd.
ZEISS microscopy solutions for semiconductor die and package failure analysis

16:20-16:45

Huanxin Ju

Application Scientist, CoreTech Integrated (Beijing) Limited
The ability of PHI surface analysis techniques(XPS/AES/TOF-SIMS)in industrial applications

16:45-17:10

Pan ChenLiang

Lab Manage & Director, ESPEC TEST TECHNOLOGY(SHANGHAI)CO., LTD
Reliability testing in semiconductor applications

17:10-17:30

Lucky Draw

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